This project describes heat dissipation and mechanical deformation in BGAs. In contemporary industries, demand for smaller packages has increased the concern of thermal management. The lead-free movement has altered the properties of BGAs and comes with its own set of concerns. Packages were simulated and analyzed thermo-electrically using CAD and ANSYS software. The goal was to improve thermal management of electrical loads in CSP BGAs. Lead-based solder simulations demonstrated higher reliability than lead-free alternatives. Results indicate that maximum temperature and stresses were concentrated at the perimeter, especially the corners. This project resulted in suggestions for improvements for existing packaging and opportunities for future projects.

• This report represents the work of one or more WPI undergraduate students submitted to the faculty as evidence of completion of a degree requirement. WPI routinely publishes these reports on its website without editorial or peer review.

Creator

• Valencia, Victoria Cirila
• Strachan, Julie Lynn
• Crowe, Patrick Hoefner

Contributors

• Hera, Adriana
• Roman, John

Publisher

• Worcester Polytechnic Institute

Identifier

• E-project-042710-163758

Advisor

• Pryputniewicz, Ryszard J.

Year

• 2010

Date created

• 2010-04-27

Resource type

• Major Qualifying Project

Major

• Mechanical Engineering

Rights statement

• In Copyright

Last modified

• 2023-09-20