"Laser micromachining is essential in todayâ€™s advanced manufacturing, of e.g., printed circuit boards and electronic components, especially laser microdrilling. Continued demands for miniaturization, in particular of high-performance MEMS components, have generated a need for smaller holes and microvias as well as smaller and more controllable spot-welds than ever before. All these neeeds require smaller taper of the microholes and more stable and controlled laser micromachining process than currently available. Therefore considerable attention must be focused on the laser process parameters that control critical specifications such as accuracy of the hole size as well as its shape and taper angle, all of which highly influence quality of the laser micromachining processes. Determination of process parameters in laser micromachining, however, is expensive because it is done mostly by trial and error. This Dissertation attempts to reduce the experimental time and cost associated with establishing the process parameters in laser micromachining by employing analytical, computational, and experimental solutions (ACES) methodology."
Worcester Polytechnic Institute
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Nowakowski, K. A. (2005). Laser beam interaction with materials for microscale applications. Retrieved from https://digitalcommons.wpi.edu/etd-dissertations/416
laser beam characteristics, heat transfer, hole profile, MEMS, hole formation, laser micromachining, laser microdrilling, plasma effects, numerical calculations, analytical solutions, silicon, 304 stainless steel, Fourier theory, lattice-phonon vibration, Microelectromechanical systems, Laser beams