Student Work

High Efficiency Coolant Nozzle Design for Abrasive Wire Wafer Slicing

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Sufficient coolant systems are vital when utilizing diamond wire slicing in the production of silicon wafers. Based on provided design parameters, multiple nozzles have been designed for Saint Gobain to use in their new abrasive diamond wire wafer-slicing machine. Each design has been analyzed using three-dimensional CFD simulation in order to obtain flow characteristics and determine the most effective design. This final design was fabricated at WPI as well as tested in the Saint Gobain testing laboratory.

  • This report represents the work of one or more WPI undergraduate students submitted to the faculty as evidence of completion of a degree requirement. WPI routinely publishes these reports on its website without editorial or peer review.
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Identifier
  • E-project-042808-144606
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Year
  • 2008
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Date created
  • 2008-04-28
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Last modified
  • 2023-01-20

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Permanent link to this page: https://digital.wpi.edu/show/r207tq965