Wodin-Schwartz, Sarah Jane
The goal of this project was to adhere miniature circuit chips to flex prints using conductive epoxy and microcontact printing techniques. To accomplish this goal, the printing process was first optimized. Tool properties were varied to determine their influence on final print quality. Optimized parameters included ideal ranges for inking force and acceptable alignment during inking. The prints created with the optimized parameters were used to bond substrates for shear resistance and electrical conductivity tests. Both tests showed that using microcontact printing to apply conductive epoxy for establishing continuity has potential to become an alternative solution for bonding electrical components.
Worcester Polytechnic Institute
Major Qualifying Project
All authors have granted to WPI a nonexclusive royalty-free license to distribute copies of the work, subject to other agreements. Copyright is held by the author or authors, with all rights reserved, unless otherwise noted.