Faculty Advisor

Wodin-Schwartz, Sarah Jane

Center

SWITZ / Zurich Project Center

Abstract

The goal of this project was to adhere miniature circuit chips to flex prints using conductive epoxy and microcontact printing techniques. To accomplish this goal, the printing process was first optimized. Tool properties were varied to determine their influence on final print quality. Optimized parameters included ideal ranges for inking force and acceptable alignment during inking. The prints created with the optimized parameters were used to bond substrates for shear resistance and electrical conductivity tests. Both tests showed that using microcontact printing to apply conductive epoxy for establishing continuity has potential to become an alternative solution for bonding electrical components.

Publisher

Worcester Polytechnic Institute

Date Accepted

November 2017

Major

Mechanical Engineering

Project Type

Major Qualifying Project

Accessibility

Unrestricted

Advisor Department

Mechanical Engineering

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