Student Work

Modification of Microcontact Printing Process for Adhesive and Conductive Ink Printing

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This project applied the mechanical and chemical characteristics of Microcontact printing to adapt the current printing process at NTB to pattern adhesive and conductive epoxies on non-standard substrates. The process development focused on implementing new methods and process parameters to produce a thin and uniform layer of epoxy. To ensure a reproducible and optimal printing process, a series of printing trials were conducted and the final printed adhesives were characterized.

  • This report represents the work of one or more WPI undergraduate students submitted to the faculty as evidence of completion of a degree requirement. WPI routinely publishes these reports on its website without editorial or peer review.
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  • E-project-101316-072517
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Year
  • 2016
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Date created
  • 2016-10-13
Location
  • Zurich
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Permanent link to this page: https://digital.wpi.edu/show/hd76s1711