Various types of grinding and abrasives are used when working with electronic materials. Based on the necessary parameters, multiple nozzle designs were created to incorporate Saint Gobain's patented nozzle profile on the high precision slicing machine used there. The standard nozzle and the new designs were analyzed after slicing glass wafers to allow for the analysis of the following to determine the best design: Chip removal rate/Kerf width; Wear on the grinding wheel; Power; Chip size; and Bottom/top edge comparison.
Worcester Polytechnic Institute
Major Qualifying Project
All authors have granted to WPI a nonexclusive royalty-free license to distribute copies of the work, subject to other agreements. Copyright is held by the author or authors, with all rights reserved, unless otherwise noted.