Faculty Advisor

Rong, Yiming

Abstract

Various types of grinding and abrasives are used when working with electronic materials. Based on the necessary parameters, multiple nozzle designs were created to incorporate Saint Gobain's patented nozzle profile on the high precision slicing machine used there. The standard nozzle and the new designs were analyzed after slicing glass wafers to allow for the analysis of the following to determine the best design: Chip removal rate/Kerf width; Wear on the grinding wheel; Power; Chip size; and Bottom/top edge comparison.

Publisher

Worcester Polytechnic Institute

Date Accepted

April 2007

Major

Mechanical Engineering

Project Type

Major Qualifying Project

Accessibility

Unrestricted

Advisor Department

Mechanical Engineering

Your accessibility may vary due to other restrictions.

Share

COinS