MIT Lincoln Laboratory
An experiment was conducted on printed circuit board parameters with regards to the 0201 surface mounted component (.020 x .010 inches) and the defects affecting them by varying four of the process parameters. Although some of the alternative products performed just as well as those presently used by MIT Lincoln Laboratory; from a business standpoint it was recommended that the process parameters used by the laboratory remain the same; .005 inch laser cut stencil, SC3401 solder paste, and the RSS (1088) profile.
Worcester Polytechnic Institute
Major Qualifying Project
Access to this report is limited to members of the WPI community. Please contact a project advisor or their department to request access
Restricted-WPI community only