Faculty Advisor
Pryputniewicz, Ryszard J.
Abstract
Development of high performance MEMS and MEMS packaging requires significant testing to ensure reliability of the finished products. To facilitate testing and characterization of MEMS and their packaging, a system capable to provide necessary information is required. Such a system should allow a full-field-of-view noninvasive characterization of MEMS with high spatial resolution and nanometer measurement accuracy, while allowing the packing to be subjected to various environmental and operational conditions. This report describes development of a system that allows quantitative characterization of MEMS and their packaging placed in a climate chamber and subjected to a range of environmental and operational conditions. Use of this compact optoelectronic system is illustrated by representative applications addressing determination of absolute shape and deformation of MEMS and MEMS packaging subjected to time varying thermomechanical loads.
Publisher
Worcester Polytechnic Institute
Date Accepted
January 2003
Major
Mechanical Engineering
Project Type
Major Qualifying Project
Copyright Statement
Access to this report is limited to members of the WPI community. Please contact a project advisor or their department to request access
Accessibility
Restricted-WPI community only
Advisor Department
Mechanical Engineering