Faculty Advisor

Pryputniewicz, Ryszard J.

Abstract

Development of high performance MEMS and MEMS packaging requires significant testing to ensure reliability of the finished products. To facilitate testing and characterization of MEMS and their packaging, a system capable to provide necessary information is required. Such a system should allow a full-field-of-view noninvasive characterization of MEMS with high spatial resolution and nanometer measurement accuracy, while allowing the packing to be subjected to various environmental and operational conditions. This report describes development of a system that allows quantitative characterization of MEMS and their packaging placed in a climate chamber and subjected to a range of environmental and operational conditions. Use of this compact optoelectronic system is illustrated by representative applications addressing determination of absolute shape and deformation of MEMS and MEMS packaging subjected to time varying thermomechanical loads.

Publisher

Worcester Polytechnic Institute

Date Accepted

January 2003

Major

Mechanical Engineering

Project Type

Major Qualifying Project

Accessibility

Restricted-WPI community only

Advisor Department

Mechanical Engineering

Advisor Program

Mechanical Engineering

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