Faculty Advisor

Pryputniewicz, Ryszard J.


Microelectromechanical systems (MEMS) are integrated mechanical and electrical devices, which can be sensors, valves, gears, mirrors, actuators, and processors that are deposited on semiconductor chips and fabricated with features micrometers in size. In order for these microscopic devices to be utilized, they must be packaged in such a way that their operating specifications are not compromised. The purpose of this MQP was to investigate the dynamics of MEMS accelerometers and evaluate if the packages have an affect on their functionality under a variety operating conditions. To determine this, the accelerometers were examined analytically and computationally, specifically with FEM analysis, to establish how they function. Then, the MEMS accelerometers were operated under conditions of varying temperature and humidity both with and without their packages. The experimental results proved that the packages cannot protect the MEMS components from all environmental conditions, and that research must be done to improve the packages currently available and to determine how changing temperature and humidity affect MEMS sensors.


Worcester Polytechnic Institute

Date Accepted

January 2002


Mechanical Engineering

Project Type

Major Qualifying Project


Restricted-WPI community only

Advisor Department

Mechanical Engineering