Pryputniewicz, Ryszard J.
Opto-electro-thermo-mechanical devices and packages, such as semiconductor lasers coupled with fiver optics and integrated electronics for providing high-speed signal transfer rates, revolutionize today's communication industry. The manufacturing processes of these packages are complicated due to micron scale dimensions of the components and the use of materials that have dissimilar thermomechanical properties, often influenced by optoelectronic interactions and boundary conditions. It is important to know how these materials interact with each other during the thermal cycles, and determination of generated loads is necessary. In this MQP, thermomechanical loads encountered during manufacture of optoelectronic packages are determined and used to estimate life and the uncertainty in the life of a device. Contributions by various parameters to this uncertainty are established and used in design of optimum thermomechanical process leading to greatest yields, reliability, and durability of the device packages.
Worcester Polytechnic Institute
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