Faculty Advisor

Datta, Ravindra

Faculty Advisor

Furlong, Cosme

Abstract

RF MEMS cantilever beam switches have many applications; however the residual stress built into these devices during fabrication constricts their use. During fabrication, the electroplating process was believed to be the main culprit of stress. The temperature and the time, which affects the bridge thickness, were varied. It was found that as both the temperature and thickness increased the residual stress increased. The residual stress observed was due to temperature gradients as well as chemical stability of the plating solution.

Publisher

Worcester Polytechnic Institute

Date Accepted

January 2004

Major

Chemical Engineering

Project Type

Major Qualifying Project

Accessibility

Restricted-WPI community only

Advisor Department

Chemical Engineering

Advisor Department

Mechanical Engineering

Advisor Program

Chemical Engineering

Advisor Program

Mechanical Engineering

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